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SIP qualification and PRA approaches

Show simple item record Ghaffarian, R. en_US Goetz, M. en_US 2004-09-17T18:13:52Z 2004-09-17T18:13:52Z 2002-09-22 en_US
dc.identifier.citation Surface Mount Technology Association en_US
dc.identifier.citation Chicago, IL, USA en_US
dc.identifier.clearanceno 02-2008 en_US
dc.description.abstract System in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package level and even more at the second and system levels. en_US
dc.format.extent 2840062 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other probability risk assessment weibull lognormal ball grid array BGA FCBGA IPC9701 solder joint reliability systems-in-a-package SIP en_US
dc.title SIP qualification and PRA approaches en_US

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