This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the ...

This report first provides a body of knowledge (BoK) survey for designing, manufacturing, and testing high-input/output (I/O) and low-pitch area array packages. It then presents test data on design, assembly, and environmental ...

High density PWB (printed wiring board) with microvia technology is required for implementation of high density and high I/O area array packages (AAP). COTS (commercial off-the-shelf) AAP packaging technologies in high ...

A typical set up used to perform lifetime tests of packaged, fiber pigtailed semiconductor lasers is described, as well as tests performed on a set of four pump lasers. It was found that two lasers failed after 3200, and ...

Reliability and quality issues are two of the main bottlenecks choking the effective commercialization of microsystem technology.

This paper describes the methodology by which we can allow each user or project a high degree of customization. To do this we rely on a mixture of public domain software and locally developed software.

The current trend in commercial processors of moving to many cores (30 to100 and beyond) on a single die poses both an opportunity and a challenge for space based processing. 1 2 The opportunity is to leverage this trend ...